Clarkson-hosted symposium focused on advancing chip manufacturing
Clarkson University’s Center for Advanced Materials Processing hosted an international symposium on chemical-mechanical planarization in Lake Placid from Aug. 2 through Aug. 5.
By the ClickNNY North Country Desk
Clarkson University’s Center for Advanced Materials Processing hosted an international symposium on chemical-mechanical planarization in Lake Placid from Aug. 2 through Aug. 5, the source material states.
The event brought together scientists and engineers working on manufacturing processes for increasingly small, powerful and complex computer chips.
Reported by ClickNNY and reviewed by an editor before publication.
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